3.1. Morphological characterization of silicon substrates
The morphology of wafer sides surfaces, i.e. mechanical polished (MP) and chemical mechanical polished (CMP), are characterized by AM-AFM. The MP surface shows features in the order of tens of nm due to mechanical finishing (see
Figure 1a), while the CMP surface is flat with details below a nm (see
Figure 1b). Accordingly, the root mean square roughness
Rq reduces from (10.7 ± 1.2) to (0.10 ± 0.025) nm for MP and CMP, respectively.
Such
Rq values are comparable to those reported in the literature [
33] where CMP wafers were polished with different abrasive SiC papers and velvet rugs imbued with Al
2O
3 slurry for assessing the evolution of the roughness parameters vs. progressively finer polishing. The
Rq value of the MP side is consistent with a surface polished by SiC papers with a grit higher than 400 (possibly 1200 [
34]), while the CMP side has an
Rq value even lower than that reported in the literature and defined “not machined surfaces” [
33] due to a higher cleanliness (compare
Figure 1b and
Figure 1d of Ref. [
33]).
To evaluate roughness parameters of the MP surface, a one-dimensional analysis of averaged topographic profiles is used [
32,
35]. The average profile is obtained by averaging 90 adjacent profile lines along the direction orthogonal to polishing features. Then, one-dimensional analysis splits the averaged topographic profile into waviness (the low-frequency components, correspondent to the polynomial background of the image) and roughness (the high-frequency components) [
36]. Such analysis measures a sort of surface oscillations with specific amplitudes and wavelengths albeit, in principle, the MP surface has a non-periodic profile (see
Supplementary Materials). Such a splitting procedure depends critically on the cut-off
C that, set to 0.0098, correctly splits the MP surface profile (see
Figure 2 and
C calculations in
Supplementary Materials).
The profile of the surface roughness obtained by one-dimensional analysis on 10 x 10 µm
2 topographic images (blue dashed line in
Figure 2) has a roughness
Rq1 of (8.5 ± 0.1) nm and a root mean square wavelength
λq, i.e. the average peak-to-valley distance [
37], of (0.72 ± 0.03) µm. The waviness, the red dashed line in
Figure 2, is characterized by a root mean square amplitude
Wq of (1.8 ± 0.6) nm. Adding
Wq to
Rq1 gives a result of (10.3 ± 0.7) nm that is equal, within experimental error, to the roughness
Rq calculated from the height distribution [
38].
3.3. Morphological characterization of ultra-thin, thin and self-standing polymeric films
The morphology of polymeric films depends strongly on the deposition technique.
In spin-coated films, it depends on the substrate, CMP or MP, and the rotational speed
ω. This latter dependence is lost in the case of CMP substrates where films are flat with an average roughness
Rq of ≈ 0.17 nm (see
Table 2) and featureless even at large scale (see
Figure 4a and its inset).
Otherwise the film morphology depends on
ω due to the morphology of MP substrates (see
Figure 4b). By comparing
Figure 1a and
Figure 4b, polymeric films clearly smooth the topographical features of bare MP substrates, although relatively large scratches are still present. The roughness of polymeric films, measured both by one-dimensional analysis,
Rq1 as well as height distribution,
Rq, are progressively reduced vs.
ω from
Rq1 ≈ 4.1 to ≈ 2.6 nm for 3500 and 4000 rpm, respectively (see
Table 2). Such a reduction, but less pronounced, is also observed on
Wq. Within experimental errors,
λq remains, on average, constant at (0.74 ± 0.30) µm and independent of
ω (see
Table 2).
For understanding the morphological evolution of polymeric films vs.
ω, one-dimensional parameters summarized in
Table 2 are compared with those obtained on bare MP substrates (
λq ≈ 0.72 µm,
Wq ≈ 1.8 nm and
Rq1 ≈ 8.5 nm). The wavelength
λq, which is determined by surface scratches, is unaffected by the presence of films and invariant with
ω. Since scratches are deeper, or at most comparable, to the film thickness
hf (in average ≈ 11 nm, cp. to
Section 3.2), their modulations are preserved even after the film deposition. results. The amplitude
Wq also depends on scratches, but it is reduced with respect to the bare MP substrate for films deposited at
ω = 4000 rpm. The roughness
Rq1 is lower than the roughness of the bare MP substrate, also for increasing
ω. Since
Rq1 is governed by small height variations around the oscillating roughness profile (see
Figure 2), its reduction means that such height modulations are progressively filled by the film for increasing rotational speed
ω.
These experimental observations can be rationalized with a single parameter termed surface planarization
P (in %) [
41]. Mathematically,
P is defined as:
where
sh and
d are the (average) peak-to-valley roughness,
viz. Rz (ISO) [
42], for the polymeric film and the bare MP substrate, respectively. If the film is conformal to substrate features,
sh →
d and
P → 0 %. Vice versa, if the film is flat
sh → 0 and
P → 100 %. For bare MP substrates,
d is (35 ± 6) nm and
sh ranges from ≈ 18 to ≈ 9 nm for 3500 and 4000 rpm, respectively (see
Table 2). Accordingly,
P runs from ≈ 49 to ≈ 73 %. In the case of spin-coated films on CMP substrates, they are flat with a small
d of (0.15 ± 0.05) Å. The same for
sh that is ≈ 0.15 nm and ≈ 0.2 nm for 3000 and 3200 rpm, respectively (see
Table 2). Substrates and films have comparable
Rz (ISO), so films are flat (
P = 100 %) as well as the CMP substrate.
Polymeric films on CMP substrates deposited by drop-casting are flat and featureless with an
Rq of (0.25 ± 0.025) nm, even at large scale size (see
Figure 4c and its inset). Similarly, self-standing polymeric films S-S have a surface roughness
Rq of (0.20 ± 0.025) nm (see
Figure 4c and its inset).
In view of the
P values reported in
Table 2, MP substrate planarization through the polymeric film is affected by both substrate corrugations and
ω. Such nanometer corrugations are also expected to locally change the film thickness.
The fluid film formed on the substrate surface during the spin-coating deposition is pivotal for the planarization effect. The A(BC)
2 solution is a non-Newtonian fluid due to the high volatility of CHCl
3 and, also, it is a low viscosity fluid due to the low concentration of the solution (
c = 1 mg·ml
-1) and the low polymer mass fraction dissolved in CHCl
3 (
wt% = 0.067). Such a fluid easily fills completely scratches independently of
ω [
43]. Such filling is also facilitated by the average width of scratches (few hundreds of nm); indeed, the lowest critical width at which trench filling is impeded is about 5 cm (as calculated from the spin-coating theory in our experimental conditions [
44]), several orders of magnitude larger than the average width of scratches. Accordingly, the liquid film spin-coated on the substrate fills the scratches completely and, after solvent evaporation, surface planarization is obtained although it will be not perfect due to the non-Netwonian behavior of the solution [
44].
The (relatively) flat regions between scratches show a different behavior. The liquid film thickness
hw is thinned for increasing
ω similarly to flat substrate like CMP. The solid film thickness
hf is reduced from 10 to 9 nm passing from
ω = 3500 to 4000 rpm (cp.
Section 2.3), a thickness comparable to small height variations determining
Rq1 (≈ 8.5 nm). In these conditions, height variations are smoothed by the film [
45,
46] and
Rq1 is reduced from ≈ 8.5 nm (bare substrate) to ≈ 4.1 nm or less (see
Table 2). The liquid film spin-coated on the substrate is governed by capillary forces (Ω
2 ≈ 10
-7 [
47]) and the solution moves towards roughness valleys (≈ 100 nm wide, as evaluated by Height–Height Correlation Function [
48]) rather than on top of hills due to their high aspect ratio [
49]. Since
hf is larger for lower
ω, the dried film on roughness hills,
hf (H), will be thicker at 3500 to 4000 rpm while the roughness valleys, like scratches, will be filled completely by the solution and
hf (V) will be independent to
ω (see
Figure 5a,b). Consequently,
hf (H) obtained at ω1,
hf (H)|
ω1, is thicker than
hf (H)|
ω2 if ω1 < ω2 while
hf (V)|
ω1 =
hf (V)|
ω2 regardless ω. As reported by
Table 2,
Rq1|
ω1 >
Rq1|
ω2 for ω1 < ω2, explaining why
P|
ω1 <
P|
ω2. These observations and results suggest that polymeric films on MP substrates have a final thickness
hf comparable to the substrate roughness in agreement to X-ray results and the literature [
50]. Other films on the CMP substrate (
Figure 5c,d) and self-standing (S-S,
Figure 5e) are featureless and do not need additional morphological descriptions.
3.4. Elastic modulus of polymeric films measured in air
The mechanical properties of polymeric films were measured by FVM [
51,
52]. Raw force-height curves composing the FVM were vertically aligned to the
x-axis (baseline subtraction,
y = 0) and horizontally shifted to the
y-axis by setting the height value to
x = 0 at
F = 0, i.e. where the tip-sample interaction starts to be in repulsive regime (also termed “contact point”, the measured height is therefore rescaled). To perform quantitative measurements of mechanical properties, force-height curves have to be converted into force-tip-sample separation (
TSS) curves [
53] by subtracting the bending of the cantilever to the height (see
Figure 6a). As reported by Cappella [
28], the approach curve is used to measure indentation
δ and elastic modulus
E, while the retraction curve is used to measure the adhesion force
Fadh and the work required to separate the tip from the sample, i.e. the work of adhesion
Wadh (see
Figure 6a).
To measure
E of polymeric films the Hertz model was adopted wherein the tip is approximated to a sphere. This approximation is valid for a tip indentation
δ smaller than the radius of curvature of the tip
Ξ. In these experiments,
Ξ = 10 nm is calculated by averaging the maximum nominal
Ξ reported in datasheets (12, 12 and 8 nm for Bruker RTESP, LTESP and MikroMash NSC35, respectively), so
δ <
Ξ for all measurements (
Table 3). The choice of the Hertz model is also validated by the adhesion force
Fadh measured as the difference between the minimum force,
Fmin, and the baseline, i.e.
F = 0 (see
Figure 6a) [
54,
55]. The calculation of
E through the Hertz model is precise if the maximum applied force
Fmax is much larger than
Fadh [
56,
57,
58]. In our films,
Fadh runs from a minimum of ≈ 6 nN (CMP-DC sample) to a maximum of ≈ 19 nN (CMP-SC sample) with
Fmax ≈ 120 nN and ≈ 260 nN, respectively (see
Table 3). The ratio
Fadh/
Fmax is within the range [0.05, 0.07] hence
E is measured correctly.
The inset of
Figure 6b shows a small hysteresis between the approach and retraction curves, typical of an elastoplastic deformation of the films [
28]. The indentation
δ, measured as the difference between
TSS values at
Fmin and
Fmax (see
Figure 6a) [
60], shows two slopes indicated by two dashed lines in
Figure 6b. The portion of the approach curve from the
Fmin plateau to the intersection
T is the elastic deformation of the film, useful to measure
E (first few nm, the red dashed line is the fitting curve obtained by using the Hertz model). Then, the film is plastically deformed by the tip for additional few nm, as indicated by the pink dashed line (guide to the eye) [
61]. The last parameter adopted in the Hertz model fitting is the Poisson’ ratio of polymeric films ν that is fixed to 0.33 from the literature [
62]. This choice is supported by experimental results on similar amorphous polymeric films (see SI of Ref. [
62]) where the magnitude of
E shows slight changes within a realistic ν interval, i.e. 0 < ν < 0.5 and, also, the trend of
E vs. film thickness
hf is preserved for all ν.
As shown in
Figure 7, thicker films have comparable
E (≈ 3 GPa, see
Table 3), in agreement with the results obtained on similar bulk films (1-10 µm thick) [
64]. Our polymeric films reach the bulk value for
hf ≥ 200 nm, independently of
c (S-S and CMP-DC were obtained from solutions with
c = 4 and 1 mg·ml
-1, respectively). For ultra-thin films,
E increases to ≈ 12 GPa with a variance of ≈ 0.3 and ≈ 7 for CMP-SC and MP-SC, respectively. Due to the high variance,
E for MP-SC samples spans from ≈ 7 to ≈ 20 GPa, suggesting that
hf is locally not homogeneous by reason of the high local roughness
Rq1 with respect to the flatness of CMP substrates.
The film thickness hf plays a key role in the E interpretation; E is accurate if the ratio δ/hf is ≤ 0.025 (film-affected zone) otherwise it is overestimated if δ/hf > 0.15 (substrate-dominated zone).
CMP-DC and S-S films are ≈ 200 nm and ≈ 400 µm thick, respectively. The tip indentation
δ is ≈ 4 and ≈ 6 nm obtained by applying a maximum force
Fmax of ≈ 120 nN and ≈ 240 nN, respectively (see
Table 3). S-S samples are definitely in the film-affected zone because
δ/
hf ≈ 1.5·10
-5. Similarly, CMP-DC samples have
δ/
hf ≈ 0.02, hence in both cases
E measurements are accurate. In the case of ultra-thin films prepared by spin-coating on CMP and MP substrates,
E was measured in flat regions between MP substrate scratches, which are morphologically similar to flat CMP substrates (but with higher roughness). CMP-SC films are flat with constant thickness
hf ≈ 12 nm;
δ is ≈ 2.6 nm by applying
Fmax of ≈ 260 nN, so
δ/
hf ≈ 0.22 > 0.15 and
E is overestimated (substrate-dominated zone). In MP-SC samples, ultra-thin films are thinner than those prepared on CMP substrates because they are deposited at higher rotational speed (
ω = 3500 rpm compared to
ω = 3200 rpm). The thickness
hf is < 12 nm,
δ is ≈ 1.6 nm for
Fmax ≈ 120 nN and
δ/
hf > 0.13 (at minimum). This value of
δ/
hf is between film- and substrate-dominated zones (transition zone), but the measured
E is comparable to CMP-SC samples therefore MP-SC samples are in substrate-dominated zone. Such overestimation of
E on ultra-thin films is reported in the literature [
64,
65,
66,
67], and it is associated with the supporting substrate [
65] and the polymer molecular weight [
68]. In addition, it can also be explained by using an extreme case-study termed “contact-induced stiffening” [
69], i.e. when the substrate is elastically deformed by the tip after a fully plastic deformation of the film [
55].
The adhesion between the tip and the sample increases for increasing interaction time, i.e. for increasing indentation
δ [
70]. This phenomenon is due to the increase of the effective surface area of the tip interacting with the sample, resulting in an increase of the overall adhesion between the tip and the sample. During sample indentation (approach curve), the tip interacts with the sample by van der Waals forces and H-bond [
71]. The sum of such interactions increase with increasing effective surface area therefore the adhesion force
Fadh is expected to increase with an increase in the maximum applied force
Fmax (see
Table 3) [
70]. Once indentation is complete, the tip is retracted from the surface (retraction curve) and the work to detach the tip from the sample (adhesion work, in J) is the work necessary to break van der Waals forces and H-bond (material dependent), and then to overcome capillary forces [
72]. As shown in
Table 3,
Fadh and
Wadh depend on film thickness with higher values for ultra-thin films possibly because their thickness is close to the critical one (≈ 10 nm) [
73]. By comparing data in
Table 3 with the literature,
Fadh is comparable to the one obtained on PMMA films [
74] suggesting that MMA branches might be exposed at the film surface.
3.5. Elastic modulus of polymeric films measured in liquid
When polymeric films are immersed in mQ water, a certain amount of water is soaked up into the film over time. As shown in
Figure 8,
E decreases exponentially for increasing immersion time
ti with a time constant
t0, defining the minimum soaked time after which the mechanical properties of wet samples saturate to
ES [
75]. As expected,
t0 and
ES depend on the thickness
hf (see
Table 4): i) ultra-thin films show a shorter minimum soaked time
t0 ≈ 0.37 h (
Figure 8a) with respect to thick and thin films that take more time to soak up water,
t0 ≈ 2.65 h (
Figure 8b); ii) wet samples reduce their elastic modulus by about 92 % and notably by 98 % for S-S samples. By comparing ultra-thin and thin films deposited on the same substrate,
viz. CMP-SC and CMP-DC samples,
ES for the former is about four time larger than the latter (see
Table 4), and thus the
E ratio observed in air is preserved in water (cp. to
Table 3).
Films on CMP substrates were used to test how indentation
δ changes for a fixed immersion time (
ti ≈ 2 h). In air, CMP-SC films show a
δ of ≈ 2.6 nm by applying a maximum force
Fmax of ≈ 260 nN whereas, after ≈ 2 h of immersion, the same indentation (
δ ≈ 2.8 nm) is obtained with one fifth of the force (
Fmax ≈ 45 nN). On CMP-DC films,
δ is doubled after
ti ≈ 2 h, increasing from ≈ 5.8 nm (in air) to ≈ 10.6 nm (in water) by applying half of the force (240 vs 110 nN). Such mechanical behavior is caused by the films swelling [
76]. On featureless surfaces like CMP-SC and CMP-DC samples, swelling is observable only by X-ray or ellipsometry measurements [
76,
77] whereas a surface rich of morphological features is necessary for AFM measurements [
78]. This is the case of MP-SC samples that are characterized in flat regions between deep scratches (cp.
Section 3.3) where swelling depends on the substrate morphology: it is large in flat regions and small within scratches due to the confinement effect of scratch walls [
79,
80]. Such local film expansions produce an increase of the surface roughness
Rq for all immersion times [
80,
81]. The roughness grows and saturates following an exponential saturating curve characterized by a time constant
tR = (0.44 ± 0.16) (
Figure 9, blue dashed line). Thanks to
in situ FVMs, the same topographic profile crossing a deep scratch (> 20 nm, taken as reference) was collected in two consecutive FVM at
ti ≈ 1.03 and 1.1 h, i.e. where
Rq starts to saturate. As shown in the inset of
Figure 9, film swelling in the flat region is clearly visible. I
n situ FVMs performed in liquid confirm also that the film is water-insoluble (see sequence of images in
Figure 9) [
7]. As expected in liquid [
72],
Fadh and
Wadh are largely reduced and constant for all samples within experimental errors (see
Table 4), confirming that capillary forces give the main contribution to the tip-sample adhesion.
In view of these results, the morphological interpretation reported in the introduction and envisaged in Ref. [
6] appears to be correct. Swelling of the star copolymer network causes a stretching of the A, B and C components. Depending on the cross-link density, the network architecture, and the polymer–solvent interaction, the swelling equilibrium is reached at different amounts of solvent uptake [
80], making film softer at the surface or in the first 10 nm at most. Notably, the minimum soaked time
t0 for thick films (2.65 h) includes the 1.5 h for having high effectiveness of antimicrobial activity due to charges [
7] and the stress time of bacteria membranes [
12]. Lastly, the large reduction of
E for S-S samples might promotes a conformal contact between bacteria and film, thus enhancing all chemical/physical phenomena related to antimicrobial activity.