Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Comparing the Performance of RF Photonic Transversal Signal Processors Based on Microcombwith Discrete Components and Integrated Chips

Version 1 : Received: 14 August 2023 / Approved: 15 August 2023 / Online: 15 August 2023 (07:41:04 CEST)

How to cite: Moss, D. Comparing the Performance of RF Photonic Transversal Signal Processors Based on Microcombwith Discrete Components and Integrated Chips. Preprints 2023, 2023081097. https://doi.org/10.20944/preprints202308.1097.v1 Moss, D. Comparing the Performance of RF Photonic Transversal Signal Processors Based on Microcombwith Discrete Components and Integrated Chips. Preprints 2023, 2023081097. https://doi.org/10.20944/preprints202308.1097.v1

Abstract

RF photonic transversal signal processors, which combine reconfigurable electrical digital signal processing and high-bandwidth photonic processing, provide a powerful solution for achieving adaptive high-speed information processing. Recent progress in optical microcomb technology provides compelling multi-wavelength sources with compact footprint, yielding a variety of microcomb-based RF photonic transversal signal processors implemented by either discrete or integrated components. Although operating based on the same principle, processors in these two forms exhibit distinct performance. This letter presents a comparative investigation into their performance. First, we compare the performance of state-of-the-art processors, focusing on the processing accuracy. Next, we analyze various factors that contribute to the performance differences, including tap number and imperfect response of experimental components. Finally, we discuss the potential for future improvement. These results provide a comprehensive comparison of microcomb-based RF photonic transversal signal processors implemented using discrete and integrated components and provide insights for their future development.

Keywords

RF photonics; optical microcombs; optical signal processing; photonic integration

Subject

Engineering, Electrical and Electronic Engineering

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