ARTICLE
|
doi:10.20944/preprints202110.0264.v2
Subject:
Engineering,
Electrical And Electronic Engineering
Keywords:
3D NAND; hole profile; mechanical stress; polysilicon channel; scaling; TCAD
Online: 21 October 2021 (12:12:18 CEST)
ARTICLE
|
doi:10.20944/preprints202109.0444.v1
Subject:
Engineering,
Electrical And Electronic Engineering
Keywords:
interfacial phase change memory; phase change memory; artificial synaptic device; superlattice; neuromorphic devices
Online: 27 September 2021 (11:32:46 CEST)