Cancer is a major concern for people, and accurately predicting the probability of cancer incidence and mortality is an important research topic. With the development of big data and artificial intelligence technology, a new machine learning model has emerged. Using 72,591 pieces of data, including age, case count, population size, race, gender, site of onset, and year of discovery, we built a machine learning model. Through calculations, we found that the decision tree, random forest, logistic regression, support vector machine, and neural network achieved testing accuracies of 62.11%, 61.68%, 54.53%, 55.72%, and 63.10%, respectively. With the help of this model, scientists and policymakers can accurately predict future cancer incidence and mortality rates through databases, allowing them to make relevant policies (such as timely allocating doctors and medical resources) to better serve the people.

The aim of this study is to investigate, by means of experimental measurements and full-wave simulations, the dominant factors for the very high-resolution (VHR) radar image speckles from exponential correlated rough surfaces. A Ka-band radar system was used to collect the return signal from such a surface sample fabricated by 3D printing, and that signal was further processed into images at different resolution scales, where the image samples were obtained by horizontally turning around the surface sample. To cross-validate the results and to further discuss the VHR speckle properties, full wave simulations by full 3D Finite Difference Time Domain (FDTD) method were conducted with 1600 realizations for the speckle analysis. At the considered very high resolution, speckle statistics show divergence from the fully developed Rayleigh distribution. The factors that impact on the high-resolution speckle properties from exponential correlated rough surface, are analyzed in views of the equivalent number of scatterers theory and scattering scales, respectively. From the data results and extended discussions, it is evident that both of the above factors matter for VHR speckle of backscattering, from the exponential correlated rough surface as a good representative for the ground surface.

In our previous study, a novel barrier processing on a porous low-dielectric constant (low-k) film was developed: an ultrathin Mn oxide on a nitrogen-stuffed porous carbon-doped organosilica film (p-SiOCH(N)) as a barrier of the Cu film was fabricated. To form a better barrier Mn₂O_3-xN film, an additional annealing at 450°C was implemented. In this study, the electrical characteristics and reliability of this integrated Cu/Mn₂O_3-xN/p-SiOCH(N)/Si structure is investigated. The proposed Cu/Mn₂O_3-xN/p-SiOCH(N)/Si capacitors exhibited poor dielectric breakdown characteristics in the as-fabricted stage, although, less degradation was found after thermal stress. Moreover, its time-dependence-dielectric-breakdown electric-field acceleration factor slightly increased after thermal stress, leading to a larger dielectric lifetime in a low electric-field as compared to other MIS capacitors. Furthermore, its Cu barrier ability under electrical or thermal stress was improved. As a consequent, the proposed Cu/Mn₂O_3-xN/p-SiCOH(N) scheme is a promising integrity for back-end-of-line interconnects.