REVIEW
|
doi:10.20944/preprints201609.0050.v1
Subject:
Engineering,
Chemical Engineering
Keywords:
DCMS, DCMSP, and sputtering; highly ionized pulse plasma magnetron sputtering (HIPIMS); bacterial inactivation kinetics; Cu and TiO2 synergic effects; interfacial charge transfer
Online: 16 September 2016 (13:31:00 CEST)