Laser ablation of silicon under an external applied magnetic field with different orientations was investigated in respect to the scanning direction and polarisation of the laser beam, by observation of the ablation patterns and debris deposition. Ultra-short ∼230 fs laser pulses of 1030 nm wavelengths were used in the single and multi-pulse irradiation modes. Ablation with an externally applied magnetic B-field (B ≈ 0.1 T) is shown to strongly affect debris formation. The mechanism of surface plasmon polariton (SPP) wave can explain the ablated periodic patterns observed with alignment along the magnetic field lines.

To harness light-matter interaction at nano-/micro-scale better control tools have to be developed. Here, it is shown that by applying external electric and/or magnetic field, ablation of Si and glass under ultra-short (sub-1~ps) laser pulse irradiation can be controlled via the Lorentz force $\mathbf{F} = e\mathbf{E} + e[\mathbf{v}\times\mathbf{B}]$, where $\mathbf{v}$ is velocity of charge $e$, $\mathbf{E}$ is the applied electrical bias and $\mathbf{B}$ is the magnetic flux density. The external electric E-field was applied during laser ablation using suspended micro-electrodes above glass substrate with an air gap for the incident laser beam. The counter-facing Al-electrodes on Si surface were used to study debris formation patterns on Si. Debris was deposited preferentially towards the negative electrode in the case of glass and Si ablation. Also, an external magnetic field was applied during laser ablation of Si in different geometries and is shown to affect ripple formation. The vectorial nature of the Lorentz force widens application potential of surface modifications and debris formation in external E-/B-fields with potential applications in mass and charge spectroscopes.