TY  - GENERIC
DO  - 10.20944/preprints202305.0419.v1
UR  - http://dx.doi.org/10.20944/preprints202305.0419.v1
TI  - A Survey on Recent Advancements in Magnetic Integration for Power Electronics – Roadmap toward High Density Integration
T2  - Preprints
AU  - Phukan, Ripun
AU  - Chen, Shin-Yu
PY  - 2023
DA  - 2023/05/06
PB  - Preprints